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Ceramic capacitor AIDE CAPACITOR 1206C0G101J152NT ideal for medium high voltage coupling wave filtering resonant applications
Manufacturer:
AIDE CAPACITOR
Description:
1.5kV 100pF C0G ±5% 1206 Ceramic Capacitors RoHS
Category:
Passives
Specifications
Voltage Rating:
1.5kV
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Replaces Part Number:
AIDE CAPACITOR
Package:
1206
Model Number:
Ceramic capacitor AIDE CAPACITOR 1206C0G101J152NT ideal for medium high voltage coupling wave filtering resonant applications
Introduction
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: RoHS compliant, REACH compliant.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Item | Description | Example |
| 1. Dimension Code | Size (L*W) in inches and mm | 1812 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | |
| 3. Nominal Electrostatic Capacity | In pF (e.g., 8R0=8.0pF, 100=10pF, 101=100pF) | 684 (680000pF = 680nF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M (20%) | |
| 5. Rated Voltage (DC) | In Volts (e.g., 250=25V, 251=250V, 252=2500V) | 251 (250V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | Au/Ag-Ni-Sn | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | ||
| Construction and Dimension | Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickle layer 5. Tin layer | N/A |
| Dimension (mm) | Part Number | L | W | T | WB | 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature Characteristic | -55~+125 | N/A |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | N/A | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P: Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms; Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. (See Note 1 for exceptions) | N/A | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | N/A | |
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | N/A | |
| Environmental Tests | Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. Test it under the flexural status. | Visual | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | Visual | |
| Reliability Tests | Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | N/A |
| Temperature Moisture Exposure | Visual No visual damage. Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | N/A | |
| High Temperature Exposure | Visual No visual damage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | N/A | |
| PCB Flexural Strength | No crack and other defect. IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. SIZE A B C 0805(2012) 1.2 4 1.65 1206(3216) 2.2 5 2 1210(3225) 2.2 5 2.9 1812(4532) 3.5 7 3.7 2220(5750) 4.5 8 5.6 | N/A | |
| Packing | Embossed Plastic Taping | Dimensions for 0805(2012)~1812(4532) type: Tape size A, B, C, D, E, F, G, H, J, T. (Refer to Page 8 for details) | N/A |
| Paper Tape Reel Packing | Dimensions for 1005(0402)~1206(3216) types. (Refer to Page 9 for details) | N/A | |
| Packing Quantity | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | N/A | |
| Packing Quantity by Size | Paper T/R (Pcs): 0603: 4000, 0805: 4000. Plastic T/R (Pcs): 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 1000 (T>1.85mm), 1812: 800, 500. | N/A | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance.
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and surface temperature of chips to T150 during preheating.
2509251626_AIDE-CAPACITOR-1206C0G101J152NT_C49326723.pdf
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