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Beijing Silk Road Enterprise Management Services Co.,LTD Company resources

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01

What is an IC chip

Integrated circuit chip is an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic base to make a chip. IC chip includes wafer chip and packaging chip. The corresponding IC chip production line is composed of wafer production line and packaging production line.

Company Resources About What is an IC chip
02

QC Procedure

1.Packaging check whether the packaging is intact, whether the packaging meets the requirements of the order, pay attention to whether the order requires the original packaging vacuum packaging is good. MSL2-5 must MLS1&6 at will, whether the material number and quantity is correct, whether the side band is neat and firm, whether the positioning hole in the braided tape punched side, whether the component shape color is consistent, (non-polar components may not be aligned in the same direction) Whether the appearance of the label is good and the production date is reasonable Visual inspection / magnifying glass / microscope / cotton swab / acetone / scraper / vernier caliper / solderability tester / professional instruments / testing machine / oscilloscope, etc. 2.Label check whether the bar code is clear and scannable, whether the LOGO is correct, whether the production date meets the order requirements, whether the green environment is in line with the order requirements, whether the factory quality inspection and packaging time is correct and reasonable 3.Pin and package check Check whether the color and shape of the pin solder ball is normal, (no oxidation, deformation, burr, damage, pollution, etc.) whether the package form is correct, whether the number of tube corners is correct, whether the tube corners are coplanar, whether there are scratches or pinholes on the surface, whether the resin is damaged, whether the package edge is rounded, whether there are chamfers Screen printing check. Check whether the screen printing is correct, pay attention to the direction of screen printing specified in the product specification. The dimple and convex marks on the silkscreen, whether the positioning holes are correct and clear. 4.Surface test Wipe with acetone, observe whether the surface of the product and the silkscreen is faded and whether the swab becomes black 5.Scratch test Whether the material scraped out with a scraper is in the form of powder 6.Product consistency Product consistency measurement parameter value only for capacitance resistance, inductance, etc. 7.dimension check Check whether the overall dimension, corner position, pin spacing and pin length are consistent with the package outline mark. 8.solderability test Whether the solderability test pin and solder ball can be soldered normally. 9.D-CAP Internal inspection and opening test (D-CAP). Is the internal matrix structure correct. 10.Fuction test whether the function and performance test function and performance test function and performance meet the specifications. Test machine, oscilloscope is equal to seven

Company Resources About QC Procedure
03

Solutions of micrcochip Electronoic components for Home Appliances

Appliance manufacturers face numerous challenges in today's ever-changing global market. Government regulations, customer expectations, competitive forces and application innovations are fueling the integration of new technologies into many appliances. Bringing these technology advancements to market can be even more challenging with shorter deadlines, the pressure to maintain and grow market share and the constant need to innovate. In addition, finding partners with technical solutions to enable these goals can be daunting and drain your resources.   Our technologies can help you implement the new features and functionality required for your next appliance design. We provide solutions for user interface, motor control, sensing, connectivity and more so your design teams can focus on implementing your application. Connectivity   The push toward smart energy is driving the need for adding connectivity to appliances so they can connect to each other, utility companies and consumers. If you are considering adding wired or wireless connectivity to your designs, we provide a wide range of wired and wireless products and support a variety of software protocols to provide cost-effective solutions that are very easy to implement in your product.   These are easy solutions for adding Wi-Fi or Wi-Fi/Bluetooth® 5.0 connectivity to the host microprocessor (MPU) or microcontroller (MCU) in your design.

Company Resources About Solutions of micrcochip Electronoic components for Home Appliances
04

QUALITY MANAGEMENT GOALS

Constantly create new development strategies to better serve our customers!   The "Quality Commitment Plan" is the product of the control over the supply channels of high-quality electronic components that has been gradually accumulated in our supplier qualification review process and has undergone a comprehensive quality process evaluation.   All Angle Technology Electronic's suppliers are continuously assessed and audited by our Quality Management team based on traded orders, quality certifications, and peer trade references. Our "Quality Commitment Plan" is created and continuously improved according to new standards, we will continue to create new development strategies to better serve our customers.     QUALITY MANAGEMENT SYSTEM           SUPPLIER MANAGEMENT     PURCHASING INCOMING MATERIAL MANAGEMENT    

Company Resources About QUALITY MANAGEMENT GOALS
01

What is an IC chip

Integrated circuit chip is an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic base to make a chip. IC chip includes wafer chip and packaging chip. The corresponding IC chip production line is composed of wafer production line and packaging production line.

Company Resources About What is an IC chip
02

QC Procedure

1.Packaging check whether the packaging is intact, whether the packaging meets the requirements of the order, pay attention to whether the order requires the original packaging vacuum packaging is good. MSL2-5 must MLS1&6 at will, whether the material number and quantity is correct, whether the side band is neat and firm, whether the positioning hole in the braided tape punched side, whether the component shape color is consistent, (non-polar components may not be aligned in the same direction) Whether the appearance of the label is good and the production date is reasonable Visual inspection / magnifying glass / microscope / cotton swab / acetone / scraper / vernier caliper / solderability tester / professional instruments / testing machine / oscilloscope, etc. 2.Label check whether the bar code is clear and scannable, whether the LOGO is correct, whether the production date meets the order requirements, whether the green environment is in line with the order requirements, whether the factory quality inspection and packaging time is correct and reasonable 3.Pin and package check Check whether the color and shape of the pin solder ball is normal, (no oxidation, deformation, burr, damage, pollution, etc.) whether the package form is correct, whether the number of tube corners is correct, whether the tube corners are coplanar, whether there are scratches or pinholes on the surface, whether the resin is damaged, whether the package edge is rounded, whether there are chamfers Screen printing check. Check whether the screen printing is correct, pay attention to the direction of screen printing specified in the product specification. The dimple and convex marks on the silkscreen, whether the positioning holes are correct and clear. 4.Surface test Wipe with acetone, observe whether the surface of the product and the silkscreen is faded and whether the swab becomes black 5.Scratch test Whether the material scraped out with a scraper is in the form of powder 6.Product consistency Product consistency measurement parameter value only for capacitance resistance, inductance, etc. 7.dimension check Check whether the overall dimension, corner position, pin spacing and pin length are consistent with the package outline mark. 8.solderability test Whether the solderability test pin and solder ball can be soldered normally. 9.D-CAP Internal inspection and opening test (D-CAP). Is the internal matrix structure correct. 10.Fuction test whether the function and performance test function and performance test function and performance meet the specifications. Test machine, oscilloscope is equal to seven

Company Resources About QC Procedure
03

Solutions of micrcochip Electronoic components for Home Appliances

Appliance manufacturers face numerous challenges in today's ever-changing global market. Government regulations, customer expectations, competitive forces and application innovations are fueling the integration of new technologies into many appliances. Bringing these technology advancements to market can be even more challenging with shorter deadlines, the pressure to maintain and grow market share and the constant need to innovate. In addition, finding partners with technical solutions to enable these goals can be daunting and drain your resources.   Our technologies can help you implement the new features and functionality required for your next appliance design. We provide solutions for user interface, motor control, sensing, connectivity and more so your design teams can focus on implementing your application. Connectivity   The push toward smart energy is driving the need for adding connectivity to appliances so they can connect to each other, utility companies and consumers. If you are considering adding wired or wireless connectivity to your designs, we provide a wide range of wired and wireless products and support a variety of software protocols to provide cost-effective solutions that are very easy to implement in your product.   These are easy solutions for adding Wi-Fi or Wi-Fi/Bluetooth® 5.0 connectivity to the host microprocessor (MPU) or microcontroller (MCU) in your design.

Company Resources About Solutions of micrcochip Electronoic components for Home Appliances
04

QUALITY MANAGEMENT GOALS

Constantly create new development strategies to better serve our customers!   The "Quality Commitment Plan" is the product of the control over the supply channels of high-quality electronic components that has been gradually accumulated in our supplier qualification review process and has undergone a comprehensive quality process evaluation.   All Angle Technology Electronic's suppliers are continuously assessed and audited by our Quality Management team based on traded orders, quality certifications, and peer trade references. Our "Quality Commitment Plan" is created and continuously improved according to new standards, we will continue to create new development strategies to better serve our customers.     QUALITY MANAGEMENT SYSTEM           SUPPLIER MANAGEMENT     PURCHASING INCOMING MATERIAL MANAGEMENT    

Company Resources About QUALITY MANAGEMENT GOALS
1