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Home > products > Embedded > XCVM1302-2HSIVSVD1760

XCVM1302-2HSIVSVD1760

manufacturer:
AMD
Description:
IC VERSALPRIME ACAP FPGA 1760BGA
Category:
Embedded
In-stock:
In Stock
Payment Method:
L/C, D/P, T/T, Western Union, MoneyGram
Shipping Method:
LCL, FCL, Express
Specifications
Category:
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status:
Active
Peripherals:
DDR, DMA, PCIe
Primary Attributes:
Versal™ Prime FPGA, 70k Logic Cells
Series:
Versal™ Prime
Package:
Tray
Mfr:
AMD
Supplier Device Package:
1760-FCBGA (40x40)
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:
-40°C ~ 100°C (TJ)
Architecture:
MPU, FPGA
Package / Case:
1760-BFBGA, FCBGA
Number Of I/O:
402
RAM Size:
-
Speed:
800MHz, 1.65GHz
Core Processor:
Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Flash Size:
-
Introduction
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 800MHz, 1.65GHz 1760-FCBGA (40x40)
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Stock:
In Stock
MOQ: