multi layer ceramic capacitor AIDE CAPACITOR 0805X7R223K101JT for resonant and coupling applications
Manufacturer:
AIDE CAPACITOR
Description:
100V 22nF X7R ±10% 0805 Ceramic Capacitors RoHS
Category:
Passives
Specifications
Voltage Rating:
100V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Replaces Part Number:
AIDE CAPACITOR
Package:
0805
Introduction
Product Overview
High-performance Multi-layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions in power supplies, chargers, networking interfaces, and lighting systems. They offer reliable performance under specified conditions and are manufactured with advanced ceramic dielectric and electrode materials.
Product Attributes
- Compliance: RoHS/REACH
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| 1. Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps (Medium and High voltage MLCC). | ||
| 2. Testing Conditions | ||
| 2.1 Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| 2.2 Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| Item | Description | |
| 1. Dimension Code | 0201 (0.02*0.01 in / 0.50*0.25 mm), 0402 (0.04*0.02 in / 1.00*0.50 mm), 0603 (0.06*0.03 in / 1.60*0.80 mm), 0805 (0.08*0.05 in / 2.00*1.25 mm), 1206 (0.12*0.06 in / 3.20*1.60 mm), 1210 (0.12*0.10 in / 3.20*2.50 mm), 1808 (0.18*0.08 in / 4.50*2.00 mm), 1812 (0.18*0.12 in / 4.50*3.20 mm), 1825 (0.18*0.25 in / 4.50*6.30 mm), 2211 (0.22*0.11 in / 5.70*2.8 mm), 2225 (0.22*0.25 in / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | |
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| 4. Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0603 (0201) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 1005 (0402) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 1608 (0603) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 2012 (0805) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 3216 (1206) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 3225 (1210) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 4520 (1808) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 4532 (1812) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 4563 (1825) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 5750 (2220) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 5763 (2225) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 5. Specification and Testing Method | ||
| Temperature | -55~+125 | Naked eye (Visual inspection), Digital caliper |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | NPO Characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P Characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56 (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF). X7R/X7T/X7P Characteristic: 10uF: Test frequency 110%KHz, Voltage 1V0.1rms. >10uF: Frequency 12024Hz, Voltage 0.5V0.1rms. (See Note 1 for exceptions) | |
| IR Insulation Resistance | NPO Characteristic: IR50000M (C10nF), IR*Cr500S (C10nF). Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P Characteristic: IR10000M (C25nF), IR*Cr100S (C25nF). | |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. No dielectric breakdown or damage. | |
| Solderability | Soldering area 90%. No damage. Pre-heating temperature 80-120, time 10-30s, lead-free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual |
| Resistance to the heat of soldering | No visual damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |
| Flexural Strength | No damage. Electro static capacity change rate C/C10%. Flexural depth 452 mm. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10%. Run 5 cycles. Test after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Test after 242 hours at normal temp & humidity. | |
| High Temperature Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Test after 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect. | |
| 6. Embossed Plastic Taping | ||
| Taping Specification | 0805: Tape size A=1.550.20, B=2.350.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.50 Max. 1206: A=1.950.20, B=3.600.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.85 Max. 1210: A=2.700.10, B=3.420.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=3.2 Max. 1808: A=2.200.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.50 -0/+0.10, T=3.0 Max. 1812: A=3.660.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=8.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=4.0 Max. | |
| 7. Packing Quantity | ||
| Paper T/R (Pcs) | 0603: 4000, 0805: 4000 | |
| Plastic T/R (Pcs) | 0805: 3000; 1206 (T1.60mm): 3000, (T>1.60mm): 2000; 1812 (T1.85mm): 1000, (T>1.85mm): 800; 1812: 500 | |
| 8. Precautions For Use | ||
| Soldering Profile | Refer to graph in enclosure page. T150 temperature difference between soldering temperature and surface temperature of chips. | |
| Manual Soldering | Handle carefully to avoid thermal cracks. Pay attention to soldering iron tip selection and temperature contact. | |
| 9. Recommended Soldering Method | ||
| Size | Method 1005: R 0201: R 0402: R 0603: R/W 0805: R/W 1206: R/W 1210: R | RReflow Soldering, WWave Soldering |
| 10. Soldering Temperature Profile | ||
| Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||
2509251626_AIDE-CAPACITOR-0805X7R223K101JT_C49326711.pdf
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