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Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805C0G102J101NT for Wave Filtering and Resonant Circuit
Manufacturer:
AIDE CAPACITOR
Description:
100V 1nF C0G ±5% 0805 Ceramic Capacitors RoHS
Category:
Passives
Specifications
Voltage Rating:
100V
Capacitance:
1nF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G102J101NT
Package:
0805
Model Number:
Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805C0G102J101NT For Wave Filtering And Resonant Circuit
Introduction
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||||||||
| Switch power supplier | |||||||||||
| AC-DC power charger | |||||||||||
| DC-DC power charger | |||||||||||
| Networking/Communication interface | |||||||||||
| LCD backlight unit power supplier | |||||||||||
| Amperite of energy saving lamps | |||||||||||
| Testing Conditions | Normal Condition: | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition: | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Temperature Characteristic: | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| Part Number Description | Dimension Code: | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| Nominal Electrostatic Capacity: | 8R08.0, 10010, 101100 (pF) | ||||||||||
| Tolerance of Electrostatic Capacity: | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| Rated Voltage (DC): | 25025, 251250, 2522500 (V) | ||||||||||
| Packing: | T Tape/Reel, P Bag packing (PE) | ||||||||||
| Construction | 1. Ceramic dielectric | N/A | |||||||||
| 2. Inner electrode | N/A | ||||||||||
| 3. Outer electrode | N/A | ||||||||||
| 4. Nickle layer | N/A | ||||||||||
| 5. Tin layer | N/A | ||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Temperature Range | -55~+125 | ||||||||||
| Specifications & Testing Method | Item | Specification/Requirement | Testing method | ||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper | |||||||||
| Static Capacity | NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms | See Note 3 | |||||||||
| X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | See Note 3 | ||||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Testing voltage 1V0.2rms for Cr1000pF; Testing frequency 110%KHz, Testing voltage 1V0.2rms for Cr1000pF. | See Note 4 | |||||||||
| X7R/X7T/X7P characteristic: 10uF, Test frequency 110%KHz, Voltage 1V0.1rms. >10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. | See Note 1 & Note 4 | ||||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | See Note 5 | |||||||||
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. | See Note 5 | ||||||||||
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | No dielectric breakdown or damage | |||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. Visual-No damage. | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |||||||||
| Flexural strength | C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. | |||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||
| DF: Refer to NO#4 | N/A | ||||||||||
| IR: Refer to NO#5 | N/A | ||||||||||
| Temperature moisture exposure | Visual: No visual damage | Test after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. | |||||||||
| Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% | N/A | ||||||||||
| DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | N/A | ||||||||||
| High temperature exposure | Visual: No visual damage | Test after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. | |||||||||
| Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% | N/A | ||||||||||
| DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | N/A | ||||||||||
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction base on the photo. | |||||||||
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (mm) | Unit:mm | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | - | 3000 (T1.60mm) / 2000 (T>1.60mm) | |||||||||
| 1210 | - | 3000 (T1.60mm) / 2000 (T>1.60mm) | |||||||||
| 1808 | - | 1000 (T1.85mm) | |||||||||
| 1812 | - | 1000 (T1.85mm) / 800 (T>1.85mm) | |||||||||
| 1812 | - | 500 | |||||||||
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control. Avoid direct contact of the tip with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
2509251626_AIDE-CAPACITOR-0805C0G102J101NT_C49326665.pdf
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