high voltage capacitor AIDE CAPACITOR 0805X7R201K500NT designed for AC DC DC DC power chargers and switch power supplies
Manufacturer:
AIDE CAPACITOR
Description:
50V 200pF X7R ±10% 0805 Ceramic Capacitors RoHS
Category:
Passives
Specifications
Voltage Rating:
50V
Capacitance:
200pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Replaces Part Number:
AIDE CAPACITOR
Package:
0805
Introduction
Product Overview
High-voltage Multi-Layer Ceramic Capacitors (MLCCs) designed for critical applications in power supplies and high-voltage circuits. These capacitors are suitable for coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer reliable performance under specified testing conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. | |
| Testing Conditions | Normal Condition | Temperature: 15~35; Humidity: 45~75%RH; Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252; Humidity: 60~70%RH; Atmosphere: 86~106kPa | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T (Dimension Code, Temperature Characteristic, Nominal Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing) | |
| Dimension Codes | Code | L*W (inch) | L*W (mm) |
| 0201 | 0.02*0.01 | 0.50*0.25 | |
| 0402 | 0.04*0.02 | 1.00*0.50 | |
| 0603 | 0.06*0.03 | 1.60*0.80 | |
| 0805 | 0.08*0.05 | 2.00*1.25 | |
| 1206 | 0.12*0.06 | 3.20*1.60 | |
| 1210 | 0.12*0.10 | 3.20*2.50 | |
| 1808 | 0.18*0.08 | 4.50*2.00 | |
| 1812 | 0.18*0.12 | 4.50*3.20 | |
| 1825 | 0.18*0.25 | 4.50*6.30 | |
| 2211 | 0.22*0.11 | 5.70*2.8 | |
| 2225 | 0.22*0.25 | 5.70*6.30 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| Packing | T (Tape/Reel), P (Bag packing) | |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimensions (mm) | Part Number | L L | W W | T T | WB WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | |
| Static Capacity Specification | Characteristic | Frequency | Voltage |
| NPO | 1000pF: 1MHz10% | 1.00.2Vrms; >1000pF: 1KHz10% | 1.00.2Vrms | |
| X7R/X7T/X7P | 10uF: 1KHz10% | 1.00.2Vrms; >10uF: 120Hz24 | 0.50.1Vrms | |
| Dissipation Factor (DF) | Characteristic | Specification |
| NPO | DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | |
| X7R/X7T/X7P | See Note 1 (detailed in provided text) | |
| Insulation Resistance (IR) | Characteristic | Specification |
| NPO | IR50000M, C10nF; IR*C500S, C10nF | |
| X7R/X7T/X7P | IR10000M, C25nF; IR*C100S, C25nF | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur): 2.5 x Ur (Ur=100V), 2.0 x Ur (Ur=200V/250V), 1.5 x Ur (Ur=450/500/630V), 1.2 x Ur (1KVUr2KV), 1.1 x Ur (2KVUr). Voltage Raising time: 110S, Maintaining time: 2S. | |
| Solderability | Soldering area 90%. Pre-heating: 80-120 (10-30s). Solder temp: 2455. Solder time: 20.5s. | |
| Resistance to Heat of Soldering | Visual: No damage, soldering area 90%. Pre-heating: 100-200 (102s). Solder temp: 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | |
| Electrostatic Capacity Change Rate | Characteristic | Change Rate |
| NPO | 0.5% or 0.5pF (larger reading) | |
| X7R | 15% | |
| X7T | -33% C/C 22% | |
| X7P | 10% | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N. Duration: 101S. | |
| Thermal Shock | Characteristic | Capacity Change Rate |
| NPO | 2.5% or 0.25pF (larger reading) | |
| X7R/X7P | 0.5% | |
| X7T | 10% | |
| Temperature Moisture Exposure | Characteristic | Capacity Change Rate | DF | IR |
| NPO | 2% or 1pF (larger reading) | - | IR2500M or IR*C25S | |
| X7R/X7T/X7P | 10% | 2 times initial standard | IR1000M or IR*C25S | |
| High Temperature Exposure | Characteristic | Capacity Change Rate | DF | IR |
| NPO | 2% or 1pF (larger reading) | - | IR4000M or IR*C40S | |
| X7R/X7T/X7P | 20% | 2 X initial standard | IR2000M or IR*C50S | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape Size A | B | C | D | E | F | G | H | J |
| 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | |
| 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | |
| 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | |
| 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | |
| 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper Size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (mm) | Type | A | B | C | D | E | F | G |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | | |
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | | 3000 (T1.60mm) / 2000 (T1.60mm) | |
| 1210 | | 2000 | |
| 1808 | | 1000 (T1.85mm) | |
| 1812 | | 1000 (T1.85mm) | |
| 1812 | | 800 | |
| Soldering Method Recommendation | Size | Soldering Method |
| 1005 | R | |
| 0201 | R | |
| 0402 | R | |
| 0603 | R/W (C1uf) | R/W (C1uf) | |
| 0805 | R/W (C4.7uf) | R/W (C4.7uf) | |
| 1206 | R/W (C10uf) | R/W (C10uf) | |
| 1210 | R | |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and contact temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and chip surface temperature T 150 during preheating.
2509251626_AIDE-CAPACITOR-0805X7R201K500NT_C49326710.pdf
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