Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R823K500NT for Coupling and Wave Filtering in High Voltage Circuits
Manufacturer:
AIDE CAPACITOR
Description:
50V 82nF X7R ±10% 0603 Ceramic Capacitors RoHS
Category:
Passives
Specifications
Voltage Rating:
50V
Capacitance:
82nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R823K500NT
Package:
0603
Introduction
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | ||||||
|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling | High voltage circuits | ||||||
| Wave filtering | High voltage circuits | |||||||
| Resonant | High voltage circuits | |||||||
| Specific Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |||||||
| Terminal Composition | Au/Ag-Ni-Sn | |||||||
| Packing | T (Tape/Reel), P (Bag packing) | |||||||
| Construction | 1 | Ceramic dielectric | ||||||
| 2 | Inner electrode | |||||||
| 3 | Outer electrode | |||||||
| 4 | Nickle layer | |||||||
| 5 | Tin layer | |||||||
| Dimensions (mm) | Part Number | L | W | T | WB | |||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||
| Specifications and Testing Methods | Temperature Range | -55~+125 | ||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) | ||||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | ||||||
| Flexural Strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10% | ||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition: Upper limit temperature 1hour, place 241 hours. Run 5 cycles. Test after place 242 hours normal temp & humidity. | ||||||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagram. | ||||||
| Embossed Plastic Taping | 0805 (2012) | Tape size: 1.55 0.20 | A: 2.35 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.50 Max | |||||
| 1206 (3216) | Tape size: 1.95 0.20 | A: 3.60 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.1, H: 1.50 -0/+0.10, J: 1.85 Max | ||||||
| 1210 (3225) | Tape size: 2.70 0.10 | A: 3.42 0.10, B: 8.00 0.10, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 3.2 Max | ||||||
| 1812 (4532) | Tape size: 3.66 0.10 | A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 8.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 4.0 Max | ||||||
| Paper Tape Reel Packing | 1005 (0402) | Paper size: W1: 0.240.02, L1: 0.450.02 | B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 2.000.05, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 0.30 Below | |||||
| 0201 | Paper size: W1: 0.370.10, L1: 0.670.10 | B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 2.000.05, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 0.80 Below | ||||||
| 0402 | Paper size: W1: 0.650.10, L1: 1.150.10 | B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 2.000.05, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 0.80 Below | ||||||
| Paper Tape Reel Packing (0603, 0805, 1206) | 0603 | Paper size: A: 1.10 0.10, B: 1.90 0.10 | C: 8.00 0.10, D: 3.50 0.05, E: 1.75 0.10, F: 4.00 0.10, G: 2.00 0.10, H: 4.00 0.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||||
| 0805 | Paper size: A: 1.45 0.15, B: 2.30 0.15 | C: 8.0 0.15, D: 3.50 0.05, E: 1.75 0.10, F: 4.00 0.10, G: 2.00 0.10, H: 4.00 0.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||||||
| 1206 | Paper size: A: 1.80 0.20, B: 3.40 0.20 | C: 8.00 0.20, D: 3.50 0.05, E: 1.75 0.10, F: 4.00 0.10, G: 2.00 0.10, H: 4.00 0.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||||||
| Reel Dimensions | 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| Top Tape Peeling Strength | Paper Taping | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||
| Packing Quantity (Pcs) | 0603 | Paper T/R: 4000 | Plastic T/R: -- | |||||
| 0805 | Paper T/R: 4000 | Plastic T/R: 3000 (T1.35mm) | ||||||
| 1206 | Paper T/R: -- | Plastic T/R: 3000 (T1.60mm) | ||||||
| 1210 | Paper T/R: -- | Plastic T/R: 2000 (T1.85mm) | ||||||
| 1812 | Paper T/R: -- | Plastic T/R: 1000 (T1.85mm) |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Please consider the following "precautions for safety" and Application Notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and select appropriate tip temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering Method Key: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
2509251626_AIDE-CAPACITOR-0603X7R823K500NT_C49326661.pdf
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