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Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805X5R106K500NT for High Voltage Power Supply Circuits
Manufacturer:
AIDE CAPACITOR
Description:
10uF ±10% 50V Ceramic Capacitor X5R 0805
Category:
Passives
Specifications
Voltage Rating:
50V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Replaces Part Number:
AIDE CAPACITOR
Package:
0805
Model Number:
Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805X5R106K500NT for High Voltage Power Supply Circuits
Introduction
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminals)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | |
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.500.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.250.20 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.600.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 0.800.20 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.250.20 | |
| Specification and Testing Method | ||
| 1. Temperature | -55~+125 | |
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| 4. Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) |
| 5. IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| 6. Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s |
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| 9. Flexural Strength | No damage. Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11. Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| 12. Temperature Moisture Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature: 402, Humidity: 90~95%RH, time: 50024 hours. Test after place 242 hours normal temp & humidity. |
| 13. High Temperature Exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after place 48 hours under normal pressure & temperature. |
| 14. PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB. Pressing direction based on diagrams. IR measurement. |
| Embossed Plastic Taping | ||
| Code | Tape size A, B, C, D, E, F, G, H, J, T | (See Page 8 for detailed dimensions) |
| Paper Tape Reel Packing | ||
| Code | Paper size W1, L1, D, C, B, P1, P2, P0, d, t | (See Page 9 for detailed dimensions) |
| Reel Dimensions | ||
| Unit: mm | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Taping Specification | ||
| Top tape peeling strength | (a) Paper Taping: Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | (See Page 11 for details per size and packing type) | |
| Precautions For Use | ||
| 1. Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |
| 2. Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |
| 3. Optimum Solder Amount for Reflow Soldering | ||
| 4. Recommended Soldering Method | (See Page 13 for details per size, temperature characteristics, rated voltage, capacitance) | RReflow Soldering, WWave Soldering |
| 10. The temperature profile for soldering | Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |
2509251626_AIDE-CAPACITOR-0805X5R106K500NT_C48579582.pdf
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