High voltage multi layer ceramic capacitor AIDE CAPACITOR 0603X5R226M100NT designed for coupling wave filtering and resonance
Manufacturer:
AIDE CAPACITOR
Description:
22uF ±20% 10V Ceramic Capacitor X5R 0603
Category:
Passives
Specifications
Voltage Rating:
10V
Capacitance:
22uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Replaces Part Number:
AIDE CAPACITOR
Package:
0603
Introduction
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. It is suitable for medium and high voltage circuits.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| Packing | T Tape/Reel, P Bag packing(PE) | ||||||||||
| Construction | Ceramic dielectric | - | |||||||||
| Inner electrode | - | ||||||||||
| Outer electrode | - | ||||||||||
| Nickle layer | - | ||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specifications and Testing Methods | Temperature | -55~+125 | |||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | ||||||||||
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Testing frequency 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms. (Refer to Note 1 for exceptions) | ||||||||||
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C10nF). Testing condition: Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA. X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF). | ||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||||||||
| Solderability | Soldering area90%. Pre-heating 80-120 (10-30s), Lead free solder, flux. Soldering 2455 (20.5s). | ||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating 100-200 (102 s), soldering 2655 (51s). Cleaning with solvent. Room temperature, 242 hours. | ||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%. DF & IR refer to NO#4 & NO#5. | ||||||||||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. | ||||||||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10%. Run 5 cycles. Test after 242 hours normal temp & humidity. | ||||||||||
| Temperature Moisture Exposure | Visual No visual damage. Temperature 402, Humidity 90~95%RH, time 50024 hours. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||||||||
| High Temperature Exposure | Visual No visual damage. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||||||||
| PCB Flexural Strength | No crack and other defect. IR. Soldering the MLCC on the PCB. Pressing direction based on photo. Sizes: 0805(2012) to 2220(5750). | ||||||||||
| Embossed Plastic Taping | Tapesize | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| Paper Tape Reel Packing | Papersize | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Reel Dimensions | Unit: mm | A | B | C | D | E | F | G | H | J | T |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - | |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - | |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | Notes | |||||||
| 0603 | 4000 | - | - | ||||||||
| 0805 | 4000 | 3000 | T1.35mm | ||||||||
| 1206 | - | 3000 | T1.60mm | ||||||||
| 1210 | - | 2000 | T1.85mm | ||||||||
| 1812 | - | 1000 | T1.85mm | ||||||||
| 1812 | - | 800 | - |
Precautions For Use
MLCCs may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and contact temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603X5R226M100NT_C48579267.pdf
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