Multi Layer Ceramic Capacitor AIDE CAPACITOR 1206C0G681J102NT for High Voltage Circuits Applications
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| General Operating Temperature | -55~+125 | |
| Dimensions & Codes | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Size (inch) | 0.02*0.01 to 0.22*0.25 | |
| Size (mm) | 0.50*0.25 to 5.70*6.30 | |
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | |
| Specific Dimensions (mm) | See table below | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |
| Nominal Electrostatic Capacity | 8R08.0pF, 10010pF, 101100pF | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250V (Code 251), 2500V (Code 252) | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Performance Specifications | Dissipation Factor (DF) | Refer to Specification Table (Page 3 & 4) |
| Insulation Resistance (IR) | NPO: 50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: 10000M (C25nF), IR*Cr100S (C>25nF) | |
| Hi-pot (DC) | 1.1x to 2.5x rated voltage depending on voltage rating | |
| Solderability | Soldering area 90% | |
| Resistance to the heat of soldering | No damage, Soldering area 90% | |
| Flexural Strength | Electrostatic capacity change rate 10% | |
| Environmental & Reliability | Thermal Shock | Capacity change rate within specified limits for NPO, X7R/X7P, X7T characteristics. |
| Temperature Moisture Exposure | Capacity change rate & DF within specified limits for NPO, X7R/X7T/X7P characteristics. IR within specified limits. | |
| High Temperature Exposure | Capacity change rate & DF within specified limits for NPO, X7R/X7T/X7P characteristics. IR within specified limits. | |
| PCB Flexural Strength | No crack and other defects after testing. | |
| Terminal Bonding Strength | No visual damage. | |
| Part Number Code | Dimension (mm) L | Dimension (mm) W | Dimension (mm) T | Dimension (mm) WB |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2211 (5728) | 5.700.50 | 2.800.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress exceeding specified ratings and conditions, potentially leading to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling queries.
- Soldering Profile: Follow recommended temperature profiles to avoid thermal cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Soldering Methods: Recommended methods include Reflow Soldering (R) and Wave Soldering (W), with specific recommendations based on size, temperature characteristics, rated voltage, and capacitance.
2509251626_AIDE-CAPACITOR-1206C0G681J102NT_C49326731.pdf

