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high voltage capacitor AIDE CAPACITOR 0805X7R472K251NT for LCD backlight unit power supplies and energy saving lamp circuits
Manufacturer:
AIDE CAPACITOR
Description:
250V 4.7nF X7R ±10% 0805 Ceramic Capacitors RoHS
Category:
Passives
Specifications
Voltage Rating:
250V
Capacitance:
4.7nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Replaces Part Number:
AIDE CAPACITOR
Package:
0805
Model Number:
high voltage capacitor AIDE CAPACITOR 0805X7R472K251NT for LCD backlight unit power supplies and energy saving lamp circuits
Introduction
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance across a range of demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 3. Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) provided for each code |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | N/A | |
| Packing | T Tape/Reel, P Bag packing (PE) | N/A | |
| 4. Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimension (mm) | L, W, T, WB values provided for each size code (e.g., 0201, 0402, etc.) | Digital Caliper | |
| 5. Specification and Testing Method | Temperature | -55~+125 | N/A |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics specified with frequency and voltage) | N/A | |
| Dissipation Factor (DF) | Specified for NPO and X7R/X7T/X7P characteristics with capacity, frequency, and voltage | N/A | |
| IR Insulation Resistance | Specified for NPO and X7R/X7T/X7P characteristics with capacity, voltage, and time | N/A | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage based on rated voltage (Ur) | N/A | |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| 8. Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 9. Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11. Thermal shock | Capacity change rate and DF specified for NPO, X7R/X7P, X7T characteristics. | 5 cycles thermal shock. Test after 242 hours normal temp & humidity. | |
| 12. Temperature moisture exposure | Visual: No visual damage. Capacity change rate and DF specified for NPO, X7R/X7T/X7P characteristics. IR specified for NPO, X7R/X7T/X7P characteristics. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | |
| 13. High temperature exposure | Visual: No visual damage. Capacity change rate and DF specified for NPO, X7R/X7T/X7P characteristics. IR specified for NPO, X7R/X7T/X7P characteristics. | Temperature 1253, Time 100048 hours. Voltage based on rated voltage. Test after 48 hours under normal pressure & temperature. | |
| 14. PCB flexural strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on provided diagrams. SIZE A B C values provided for different MLCC sizes. | |
| 6. EMBOSSED PLASTIC TAPING | Embossed tape reel packing | Dimensions (A, B, C, D, E, F, G, H, J, T) specified for 0805 to 1812 types. | N/A |
| Paper tape reel packing | Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) specified for 1005, 0201, 0402, 0603, 0805, 1206 types. | N/A | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | N/A | |
| Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N (Embossed Taping) | N/A | |
| Packing quantity | Quantities specified for Paper T/R and Plastic T/R for various sizes (e.g., 0603, 0805, 1206, 1210, 1812). | N/A | |
| 9. Recommended Soldering Method | Method (RReflow Soldering, WWave Soldering) specified for different sizes, temperature characteristics, rated voltage, and capacitance ranges. | ||
| 10. The temperature profile for soldering | Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. | ||
2509251626_AIDE-CAPACITOR-0805X7R472K251NT_C49326718.pdf
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